BQ27520-G4 Datasheet, PDF (5/34 Pages) Texas Instruments – System-Side Impedance Track Fuel Gauge

www.ti.com
bq27520-G4
SLUSB20B – NOVEMBER 2012 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_REGIN
V_CE
V_CC
V_IOD
V_BAT
V_I
T_A
T_stg
Regulator input
CE input pin
Supply voltage
Open-drain I/O pins (SDA, SCL, SOC_INT)
BAT input pin
Input voltage to all other pins
(BI/TOUT, TS, SRP, SRN, BAT_LOW, BAT_GD)
Operating free-air temperature
Storage temperature
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–40
–65
MAX
5.5
6.0 ⁽²⁾
V_REGIN + 0.3
2.75
5.5
5.5
6.0 ⁽²⁾
V_CC + 0.3
85
150
UNIT
V
V
V
V
V
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.
7.2 ESD Ratings
V_ESD Electrostatic discharge
Human-body model (HBM) ⁽¹⁾
All pins except E2
Pin E2
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
VALUE
2000
1500
UNIT
V
7.3 Recommended Operating Conditions
T_A = –40°C to 85°C, V_REGIN = V_BAT = 3.6 V (unless otherwise noted)
V_REGIN
C_REGIN
C_LDO25
t_PUCD
Supply voltage
No operating restrictions
No flash writes
External input capacitor for internal
LDO between REGIN and V_SS
External output capacitor for internal
LDO between V_CC and V_SS
Power-up communication delay
Nominal capacitor values specified.
Recommend a 5% ceramic X5R-
type capacitor located close to the
device.
MIN
NOM
MAX UNIT
2.8
4.5
V
2.45
2.8
0.1
μF
0.47
1
μF
250
ms
7.4 Thermal Information
over operating free-air temperature (unless otherwise noted)
THERMAL METRIC⁽¹⁾
bq27520-G4
YZF (DSBGA)
UNIT
15 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
70
°C/W
17
°C/W
20
°C/W
1
°C/W
18
°C/W
NA
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq27520-G4
Submit Documentation Feedback
5