ADC12QS065_14 Datasheet, PDF (5/33 Pages) Texas Instruments – Quad 12-Bit 65 MSPS A/D Converter with LVDS Serialized Outputs

ADC12QS065
www.ti.com
Pin No.
ANALOG POWER
1,15,17,19,
58,59
2,5,8,11,
14,16,18,
46,49,60
DIGITAL POWER
26,53
27, 52
28, 51
30,35,40, 45,50
Symbol
V_A
AGND
SNOSAD6H – JULY 2005 – REVISED MARCH 2007
PIN DESCRIPTIONS (continued)
Description
Positive analog supply pins. These pins should be connected to a quiet +3.3V source
and bypassed to AGND with 0.1 µF capacitors located near these power pins, and with
a 10 µF capacitor.
The ground return for the analog supply.
NOTE: The exposed pad on the WQFN package must be soldered to AGND.
V_D
DGND
V_DR
DRGND
Positive digital supply pin. This pin should be connected to the same quiet +3.3V source
as is V_A and be bypassed to DGND with a 0.1 µF capacitor located near the power pin
and with a 10 µF capacitor.
The ground return for the digital supply.
Positive driver supply pin for the ADC12QS065's output drivers. This pin should be
connected to a voltage source of +2.5V to V_D and be bypassed to DR GND with a 0.1
µF capacitor. If the supply for this pin is different from the supply used for V_A and V_D, it
should also be bypassed with a 10 µF capacitor. V_DR should never exceed the voltage
on V_D. All bypass capacitors should be located near the supply pin.
The ground return for the ADC12QS065's output drivers.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)(4)
V_A, V_D, V_DR
|V_A–V_D|
Voltage on any pin (excludes pins 29 to 45)
Voltage on any pin (pins 29 to 45)
Input Current at Any Pin⁽⁵⁾
Package Input Current⁽⁵⁾
Package Dissipation at T_A = 25°C
ESD Susceptibility
Soldering Temperature
Storage Temperature
Human Body Model⁽⁷⁾
Machine Model⁽⁷⁾
Infrared (10 sec.)⁽⁸⁾
3.8V
≤ 100 mV
−0.3V to (V_A or V_D +0.3V)
-0.3V to 2V
±25 mA
±50 mA
See ⁽⁶⁾
2500V
250V
235°C
−65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(3) Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
(4) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(5) When the input voltage at any pin exceeds the power supplies (that is, V_IN < AGND, or V_IN > V_A), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two.
(6) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature, (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax - T_A )/θ_JA. In the 60-pin WQFN, θ_JA is 20°C/W with the exposed pad soldered to a ground plane, so P_DMAX = 2 W at
the maximum operating ambient temperature of 85°C. Note that the power consumption of this device under normal operation will
typically be about 900 mW. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(7) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
(8) Reflow Reflow temperature profiles are different for lead-free and non-lead-free packages.
Copyright © 2005–2007, Texas Instruments Incorporated
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