ADC12040 Datasheet, PDF (5/29 Pages) National Semiconductor (TI) – 12-Bit, 40 MSPS, 340 mW A/D Converter with Internal Sample-and-Hold

ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Absolute Maximum Ratings ^(1)(2)(3)
V_A, V_D, V_DR
|V_A–V_D|
Voltage on Any Input or Output Pin
Input Current at Any Pin ⁽⁴⁾
Package Input Current ⁽⁴⁾
Package Dissipation at T_A = 25°C
ESD Susceptibility
Human Body Model ⁽⁶⁾
Machine Model ⁽⁶⁾
Soldering Temperature, Infrared, 10 sec. ⁽⁷⁾
Storage Temperature
6.5V
≤ 100 mV
−0.3V to (V_A or V_D +0.3V)
±25 mA
±50 mA
See ⁽⁵⁾
2500V
250V
235°C
−65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, V_IN < AGND, or V_IN > V_A), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two. This note does not apply to any power or ground pin.
(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature, (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax - T_A )/θ_JA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
(7) The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the
temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body
must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle.
Operating Ratings ⁽¹⁾⁽²⁾
Operating Temperature
Supply Voltage (V_A, V_D)
Output Driver Supply (V_DR)
V_REF Input
V_CM Input
CLK, PD, OE
V_IN Input
|AGND–DGND|
−40°C ≤ T_A ≤ +85°C
+4.75V to +5.25V
+2.35V to V_D
1.0V to 2.2V
0.5V to 3.0V
−0.05V to (V_D + 0.05V)
−0V to (V_A − 1.0V)
≤100mV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
Package Thermal Resistance
Package
32-Lead LQFP
θ_JA
79°C / W
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