ADC10D020_15 Datasheet, PDF (5/39 Pages) Texas Instruments – ADC10D020 Dual 10-Bit, 20 MSPS, 150 mW A/D Converter

ADC10D020
www.ti.com
SNAS143D – SEPTEMBER 2001 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^(1)(2)(3)
Positive Supply Voltages
Voltage on Any Pin
Input Current at Any Pin ⁽⁴⁾
Package Input Current ⁽⁴⁾
Package Dissipation at T_A = 25°C
ESD Susceptibility ⁽⁶⁾
Soldering Temperature, Infrared,10 sec. ⁽⁷⁾
Storage Temperature
Human Body Model
Machine Model
3.8V
−0.3V to (V_A or V_D +0.3V)
±25 mA
±50 mA
See ⁽⁵⁾
2500V
250V
235°C
−65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (V_IN < GND or V_IN > V_A or V_D), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 25 mA to two.
(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax - T_A )/θ_JA. In the 48-pin TQFP, θ_JA is 76°C/W, so P_DMAX = 1,645 mW at 25°C and 855 mW at the maximum
operating ambient temperature of 85°C. Note that the power dissipation of this device under normal operation will typically be about 170
mW (150 mW quiescent power + 20 mW due to 1 LVTTL load on each digital output). The values for maximum power dissipation listed
above will be reached only when the ADC10D020 is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
(7) See AN450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any
post 1986 Texas Instruments Linear Data Book, for other methods of soldering surface mount devices.
Operating Ratings ⁽¹⁾⁽²⁾
Operating Temperature Range
V_A, V_D Supply Voltage
V_DR Supply Voltage
V_IN Differential Voltage Range
V_CM Input Common Mode Range
V_REF Voltage Range
Digital Input Pins Voltage Range
GAIN = Low
GAIN = High
GAIN = Low
GAIN = High
−40°C ≤ T_A ≤ +85°C
+2.7V to +3.6V
±V_REF/2
±V_REF
V_REF/4 to (V_A–V_REF/4)
V_REF/2 to (V_A–V_REF/2)
+1.5V to V_D
0.8V to 1.5V
−0.3V to (V_A +0.3V)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
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