TLC5926_15 Datasheet, PDF (4/39 Pages) Texas Instruments – 16-Channel Constant-Current LED Sink Drivers

TLC5926, TLC5927
SLVS677C – JULY 2008 – REVISED OCTOBER 2015
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
V_DD
Supply voltage
V_I
Input voltage
V_O
Output voltage
I_OUT
Output current
I_GND
GND terminal current
T_A
Free-air operating temperature range
T_J
Operating junction temperature range
T_stg
Storage temperature range
MIN
MAX
UNIT
0
7
V
–0.4
V_DD + 0.4
V
–0.5
20
V
120
mA
1920
mA
–40
125
°C
–40
150
°C
–55
150
°C
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
VALUE
±2000
±500
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS
V_DD
Supply voltage
V_O
Supply voltage to the output pins OUT0–OUT15
I_O
Output current
DC test circuit
V_O ≥ 0.6 V
V_O ≥ 1 V
I_OH
High-level output current
SDO
I_OL
Low-level output current
SDO
V_IH
High-level input voltage
CLK, OE(ED2), LE(ED1), and SDI
V_IL
Low-level input voltage
CLK, OE(ED2), LE(ED1), and SDI
MIN
3
5
0.7 × V_DD
0
MAX
5.5
17
UNIT
V
V
mA
120
–1 mA
1 mA
V_DD
V
0.3 × V_DD
V
7.4 Thermal Information
TLC5926, TLC5927
THERMAL METRIC ⁽¹⁾
DBQ (SSOP) DW (SOIC)
PWP
(HTSSOP)
UNIT
24 PINS
24 PINS
24 PINS
Junction-to-ambient thermal resistance (Mounted on JEDEC 1-
layer board (JESD 51-3), No airflow)
99.8
80.5
63.9
°C/W
R_θJA
Junction-to-ambient thermal resistance (Mounted on JEDEC 4-
layer board (JESD 51-7), No airflow)
61
45.5
42.7
°C/W
Junction-to-ambient thermal resistance (Mounted on JEDEC 4-
layer board (JESD 51-5), No airflow)
-
-
34.5
°C/W
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
49.6
40.8
23.9
°C/W
38
40.5
21.6
°C/W
13.5
18
0.8
°C/W
37.7
40.2
21.4
°C/W
-
-
5.5
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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