TLC27L4IDR Datasheet, PDF (4/44 Pages) Texas Instruments – LinCMOSE PRECISION QUAD OPERATIONAL AMPLIFIERS

TLC27L4, TLC27L4A, TLC27L4B, TLC27L4Y, TLC27L9
LinCMOS™ PRECISION QUAD OPERATIONAL AMPLIFIERS
SLOS053C – OCTOBER 1987 – REVISED AUGUST 1994
TLC27L4Y chip information
These chips, when properly assembled, display characteristics similar to the TLC27L4C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(13)
(12) ⁽¹¹⁾ (10)
(9)
68
(1)
(2)
(3) _{(4) (5)}
(6)
108
VDD
(8)
(4)
(3)
1IN +
+
(1)
(2)
1OUT
1IN –
–
(7)
2OUT
(10)
3IN +
+
(9)
3IN –
–
(14)
4OUT
+ ⁽⁵⁾
(6)
–
(8)
2IN +
2IN –
3OUT
+ ⁽¹²⁾
(13)
–
4IN +
4IN –
(11)
(7)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
4
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