THS4541-Q1 Datasheet, PDF (4/60 Pages) Texas Instruments – 850-MHz Fully Differential Amplifier

THS4541-Q1
SLOS930A – NOVEMBER 2015 – REVISED NOVEMBER 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
MIN
MAX
UNIT
Supply voltage, (Vs+) – Vs–
5.5
V
Voltage
Input/output voltage range
(Vs–) – 0.5
(Vs+) + 0.5
V
Differential input voltage
±1
V
Continuous input current
±20
mA
Current
Continuous output current
±80
mA
Continuous power dissipation
See Thermal Information table and Thermal Analysis section
Maximum junction temperature
150
°C
Temperature
Operating free-air temperature range
–40
125
°C
Storage temperature, T_stg
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Vs+
Single-supply voltage
T_A
Ambient temperature
MIN
NOM
MAX UNIT
2.7
5
5.4
V
–40
25
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
THS4541-Q1
RGT (VQFN)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
52
°C/W
69
°C/W
25
°C/W
2.7
°C/W
25
°C/W
9.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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