THS3491 Datasheet, PDF (4/28 Pages) Texas Instruments – 900-MHz, High-Power Output, Current Feedback Amplifier

THS3491
SBOS875 – AUGUST 2017
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Current
Temperature
Supply voltage, (+V_S) – (–V_S)
Supply voltage turn on, turn off maximum dV/dT⁽²⁾
Input/output voltage range
Differential input voltage
Continuous input current⁽³⁾
Continuous output current⁽³⁾
Operating, T_A
Junction, T_J(4)
Storage⁽⁵⁾, T_stg
Normal operation
Continuous operation, long-term reliability
MIN
(–V_S) – 0.5
TBD
–65
MAX
33
1
(+V_S) + 0.5
±0.5
±10
±100
TBD
150
125
150
UNIT
V
V/µs
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Stay below this dV/dT supply turn on and off edge rate to make sure that the edge-triggered ESD absorption device across the supply
pins remains open. Exceeding this supply edge rate may transiently show a short circuit across the supplies.
(3) Long-term continuous current for electro-migration limits.
(4) Thermal shutdown at approximately 165°C junction temperature and recovery at approximately 145°C
(5) See the MSL/Reflow Rating information provided with the material, or see the TI web site at www.ti.com for the latest information.
7.2 ESD Ratings
V_(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Electrostatic discharge _{Charged-device model (CDM), per JEDEC specification JESD22-C101(2)}
VALUE
±1000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(+V_S) – (–V_S) Supply voltage
Dual supply
Single supply
T_A
Operating free-air temperature
MIN
NOM
MAX UNIT
±7
±15
±16
V
14
30
32
–40
85 °C
7.4 Thermal Information
THS3491
THERMAL METRIC⁽¹⁾
DDA
(SO PowerPAD™)
RGT
(VQFN With
Thermal Pad)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
44.5
49.6
°C/W
66.8
55.4
°C/W
19.2
23.1
°C/W
6.4
1.8
°C/W
19.5
23.2
°C/W
7.5
7.8
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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