THS3491 Datasheet, PDF (3/28 Pages) Texas Instruments – 900-MHz, High-Power Output, Current Feedback Amplifier

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5 Device Comparison Table
THS3491
SBOS875 – AUGUST 2017
DEVICE
SUPPLY, V_S
(V)
SSBW,
A_V = 5
(MHz)
THS3491
±15
900
THS3095
±15
190
THS3001
±15
350
THS3201
±7.5
565
(1) Slew rate from FPBW of 135 MHz, 4 V_PP.
(2) Slew rate from FPBW of 32 MHz, 20 V_PP.
(3) Slew rate from FPBW of 880 MHz, 2 V_PP.
MAXIMUM ICC INPUT NOISE,
AT 25°C
(mA)
V_n
(nV/√Hz)
17.3
1.7
9.5
1.6
9
1.6
21
1.65
THD,
2 V_PP AT 10 kHz
(dBc)
SLEW RATE
(V/µs)
–56
8000
–37
1200 ⁽¹⁾
–25
1400 ⁽²⁾
N/A
3900 ⁽³⁾
LINEAR
OUTPUT
CURRENT
(mA)
±380
±250
±120
±80
6 Pin Configuration and Functions
DDA Package
8-Pin SO PowerPAD™
Top View
REF 1
VIN± 2
VIN+ 3
±VS 4
8 PD
7 +VS
6 VOUT
5 NC
RGT Package
16-Pin VQFN With Thermal Pad
Top View
PD DNC +VS +VS
16
15
14
13
FB ¹
12 NC
NC ²
±
VIN± 3
+
11 VOUT
10 VOUT
VIN+ 4
9 _NC
5
6
7
8
GND Tj_Sense ±VS ±VS
NAME
DNC
GND
FB
NC
PD
REF
Tj_Sense
VIN–
VIN+
VOUT
–VS
+VS
PIN ⁽¹⁾
VQFN-16
15
5
1
2, 9, 12
16
—
6
3
4
10, 11
7, 8
13, 14
SO-8
PowerPAD
—
—
—
5
8
1
—
2
3
6
4
7
I/O
—
GND
O
—
I
I
O
I
I
O
Power
Power
Pin Functions
DESCRIPTION
Do not connect (there may be a function on this pin internally)
Ground, PD logic reference on the VQFN-16 (RGT) package
Input side feedback pin
No connect (there is no internal connection)
Amplifier power down: low = amplifier disabled, high (default) = amplifier enabled
PD logic reference on the SOIC-8 (DDA) package
Voltage proportional to die temperature
Inverting input
Noninverting input
Output of amplifier
Negative power supply
Positive power supply
(1) Both packages include a backside thermal pad. The thermal pad can be connected to a heat spreading plane that can be at any voltage
because the device die is electrically isolated from this metal plate. The thermal pad can also be unused (not connected to any heat
spreading plane or voltage) giving higher thermal impedance.
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