SN74CB3Q3125_15 Datasheet, PDF (4/26 Pages) Texas Instruments – Quadruple FET Bus Switch

SN74CB3Q3125
SCDS143C – OCTOBER 2003 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC
Supply voltage
V_IN
Control input voltage⁽²⁾⁽³⁾
V_I/O
Switch I/O voltage^(2)(3)(4)
I_I/K
Control input clamp current
I_I/OK
I/O port clamp current
I_IO
ON-state switch current⁽⁵⁾
Continuous current through V_CC or GND
T_J
Junction temperature
T_stg
Storage temperature
V_IN < 0
V_I/O < 0
MIN MAX
–0.5 4.6
–0.5
7
–0.5
7
–50
–50
±64
±100
150
–65 150
UNIT
V
V
V
mA
mA
mA
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) V_I and V_O are used to denote specific conditions for V_I/O.
(5) I_I and I_O are used to denote specific conditions for I_I/O.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
+2000
+1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC Supply voltage
V_IH High-level control input voltage
V_IL Low-level control input voltage
V_I/O Data input and output voltage
T_A
Operating free-air temperature
V_CC = 2.3 V to 2.7 V
V_CC = 2.7 V to 3.6 V
V_CC = 2.3 V to 2.7 V
V_CC = 2.7 V to 3.6 V
MIN
MAX UNIT
2.3
3.6 V
1.7
5.5
V
2
5.5
0
0.7
V
0
0.8
0
5.5 V
–40
85 °C
(1) All unused control inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
6.4 Thermal Information
SN74CB3Q3257
THERMAL METRIC⁽¹⁾
DBQ
(SSOP)
DGV (TVSOP)
PW (TSSOP)
RGY (VQFN) UNIT
16 PINS
14 PINS
14 PINS
14 PINS
R_θJA Junction-to-ambient thermal resistance
90
127
113
47
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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