SMJ320C30KGDM40C Datasheet, PDF (4/10 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C30KGDB
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007
SMJ320C30KGDB (rev 7.x) known good die pad information
Figure 2 shows the SMJ320C30KGDB die-numbering format. See Table 1 for SMJ320C30KGDB die pad
information.
Figure 2. ’320C30KGD Die-Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
D The ’C30 signal identities in relation to the pad numbers
D The ’C30 X,Y coordinates, where bond pad 52 serves as the origin (0,0)
In addition, significant specifications include:
D X,Y coordinate data is in microns.
D Coordinate origin is at (0,0) (center of bond pad 52).
D The active silicon dimensions are 7 779.60 µm × 9 453.10 µm (306.28 mils × 372.17 mils).
D The die size is approximately 7 950.20 µm × 9 779.00 µm (313.00 mils × 385.00 mils).
D Bond pad dimensions are 103.50 µm × 103.50 µm (4.07 mils × 4.07 mils).
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