SMJ320C30KGDM40C Datasheet, PDF (2/10 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C30KGDB
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007
description (Continued)
High-level language support is easily implemented through a register-based architecture, large address space,
powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
For additional information when designing for cold temperature operation, please see Texas Instruments
application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature
number SGUA001.
known good die (KGD) technology
KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current
verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe
process. This process uses standard probed product that is tested in wafer form at speed and elevated
temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for
shipment.
electrical specifications
For electrical and timing specifications, see the SMJ320C30 Digital Signal Processor data sheet, literature
number SGUS014.
SMJ
320
C 30 KGD M 40
C
PREFIX
SMJ = MIL-PRF-38535
DIE REVISION
’C30
C = Revision 8.0
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
TEMPERATURE RANGE
M = − 55°C to 125°C
L = 0°C to 70°C
DEVICE
30 = Floating-Point DSP
PACKAGE TYPE
KGD = Known Good Die
Figure 1. SMJ320C30KGDB Device Nomenclature
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