SM320C6202-EP Datasheet, PDF (4/83 Pages) Texas Instruments – FIXED-POINT DIGITAL SIGNAL PROCESSOR

SM320C6202ĆEP
FIXEDĆPOINT DIGITAL SIGNAL PROCESSOR
SGUS044−JULY 2003
device characteristics (continued)
Table 1. Characteristics of the Pin-Compatible DSPs
HARDWARE FEATURES
C6202
C6203B
C6204
EMIF
√
√
√
Peripherals
DMA
Expansion Bus
4-Channel
√
4-Channel With
Throughput
Enhancements
√
4-Channel With
Throughput
Enhancements
√
McBSPs
3
3
2
32-Bit Timers
2
2
2
Size (Bytes)
256K
384K
64K
Internal Program
Memory
Organization
Block 0:
128K-Byte
Mapped Program
Block 1:
128K-Byte
Cache/Mapped
Program
Block 0:
256K-Byte Mapped
Program
Block 1:
128K-Byte
Cache/Mapped
Program
1 Block:
64K-Byte
Cache/Mapped
Program
Size (Bytes)
128K
512K
64K
Internal Data Memory
Organization
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
CPU ID + CPU Rev ID Control Status Register (CSR.[31:16])
0x0002
0x0003
0x0003
Frequency
MHz
200, 250
250, 300
200
Cycle Time
ns
4 ns (6202-250)
5 ns (6202-200)
3.33 ns (6203B-300)
4 ns (6203B-250)
4 ns (03BGNZA-250)
5 ns (6204-200)
Voltage
Core (V)
I/O (V)
1.5
1.8
1.5
1.7
3.3
3.3
3.3
PLL Options
CLKIN frequency multiplier [Bypass (x1),
x4, x6, x7, x8, x9, x10, and x11]
x1, x4
(Both Pkgs)
All PLL Options
(GLS/GNY Pkgs)
x1, x4, x8, x10
(GNZ Pkg)
x1, x4
(Both Pkgs)
27 x 27 mm
352-pin GJL
352-pin GNZ
−
BGA Packages
18 x 18 mm
18 x 18 mm
384-pin GLS
340-pin GLW
−
384-pin GNY
(2.x, 3.x only)
−
16 x 16 mm
−
−
288-pin GHK
Process Technology
µm
0.18 µm
0.15 µm
0.15 µm
Product
Status†
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
PD
PD
PD
† _{PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments}
standard warranty. Production processing does not necessarily include testing of all parameters.
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