OPA354A-Q1 Datasheet, PDF (4/37 Pages) Texas Instruments – 250-MHz, Rail-to-Rail I/O, CMOS Operational Amplifiers

OPA354A-Q1, OPA2354A-Q1, OPA4354-Q1
SBOS492E – JUNE 2009 – REVISED AUGUST 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V+ to V–, V_S
Signal input terminals voltage⁽²⁾, V_IN
Output short-circuit duration⁽³⁾
Operating temperature, T_A
Junction temperature, T_J
Storage temperature, T_stg
MIN
MAX
7.5
(V–) – 0.5 (V+) + 0.5
Continuous
–55
150
150
–65
150
UNIT
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short circuit to ground, one amplifier per package
6.2 ESD Ratings
OPA354A-Q1 in 5-Pin SOT-23 package and OPA2354A-Q1 in 8-Pin VSSOP package
V_(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011
OPA4354-Q1 in 14-Pin TSSOP package
V_(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011
VALUE
±2000
±1000
±2000
±250
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage, V– to V+
T_A
Operating free-air temperature
MIN
MAX UNIT
2.5
5.5 V
–40
125 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA354A-Q1
DBV (SOT-23)
OPA2354A-Q1
DGK (VSSOP)
OPA4354-Q1
PW (TSSOP)
UNIT
5 PINS
8 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
216.3
84.3
43.1
3.8
42.3
N/A
175.9
67.8
97.1
9.3
95.5
N/A
92.6
°C/W
27.5
°C/W
33.6
°C/W
1.9
°C/W
33.1
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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