OPA170_12 Datasheet, PDF (4/30 Pages) Texas Instruments – 36V, Single-Supply, SOT553, Low-Power OPERATIONAL AMPLIFIERS

OPA170
OPA2170
OPA4170
SBOS557A – AUGUST 2011 – REVISED SEPTEMBER 2011
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ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, T_A = –40°C to +125°C.
At T_A = +25°C, V_CM = V_OUT = V_S/2, and R_L = 10kΩ connected to V_S/2, unless otherwise noted.
OPA170, OPA2170, OPA4170
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TEMPERATURE
Specified range
–40
+125
°C
Operating range
–55
+150
°C
THERMAL INFORMATION: OPA170
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
8 PINS
149.5
97.9
87.7
35.5
89.5
N/A
OPA170
DBV (SOT23)
5 PINS
245.8
133.9
83.6
18.2
83.1
N/A
DRL (SOT553)
5 PINS
208.1
0.1
42.4
0.5
42.2
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2170
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
8 PINS
134.3
72.1
60.6
18.2
53.8
N/A
OPA2170
DCU (VSSOP)
8 PINS
175.2
74.9
22.2
1.6
22.8
N/A
DGK (MSOP)
8 PINS
180
55
130
5.3
120
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4170
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
14 PINS
93.2
51.8
49.4
13.5
42.2
N/A
OPA4170
PW (TSSOP)
14 PINS
106.9
24.4
59.3
0.6
54.3
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): OPA170 OPA2170 OPA4170