OPA1641-Q1 Datasheet, PDF (4/31 Pages) Texas Instruments – SoundPlus JFET-Input, Automotive-Grade, Audio Operational Amplifiers

OPA1641-Q1, OPA1642-Q1
SBOS791 – JUNE 2017
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S
Supply voltage
V_IN
Input voltage⁽²⁾
I_IN
Input current⁽²⁾
V_IN(DIFF) Differential input voltage
I_O
Output short-circuit⁽³⁾
T_A
Operating temperature
T_J
Junction temperature
T_stg
Storage temperature
MIN
MAX
40
(V–) – 0.5 (V+) + 0.5
±10
±VS
Continuous
–55
125
–65
150
–65
150
UNIT
V
V
mA
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be
current-limited to 10 mA or less. The input voltage and output negative-voltage ratings can be exceeded if the input and output current
ratings are followed.
(3) Short-circuit to V_S / 2 (ground in symmetrical dual-supply setups), one amplifier per package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±3000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+, V–)
Specified temperature
Single supply
Dual supply
MIN
4.5
±2.25
–40
NOM
MAX
36
±18
125
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA1641-Q1, OPA1642-Q1
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
160
180
°C/W
75
55
°C/W
60
130
°C/W
9
n/a
°C/W
50
120
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: OPA1641-Q1 OPA1642-Q1