OPA1632 Datasheet, PDF (4/30 Pages) Texas Instruments – High-Perfomance, Fully-Differential AUDIO OP AMP

OPA1632
SBOS286C – DECEMBER 2003 – REVISED OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
±V_S
V_I
I_O
V_ID
T_J
T_STG
Supply Voltage
Input Voltage
Output Current
Differential Input Voltage
Maximum Junction Temperature
Operating Free-Air Temperature Range
Storage Temperature Range
MIN
MAX
UNIT
±16.5
V
±V_S
V
150
mA
±3
V
150
°C
–40
85
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the
PowerPAD thermally-enhanced package.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
Machine Model
VALUE
±1000
±500
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
V
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+ – V-)
T_A
Dual
Single
C-suffic
I-suffic
MIN
MAX UNIT
±2.5
±15
V
5
30
-0
70
°C
.40
85
6.4 Thermal Information
OPA1632
THERMAL METRIC⁽¹⁾
D
(SOIC)
RGN
(MSOP-PowerPAD)
UNIT
8 PINS
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
114.5
60.3
54.8
14
43.3
n/a
59.8
°C/W
57.7
°C/W
38.7
°C/W
2.7
°C/W
38.4
°C/W
8.4
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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