OPA1632 Datasheet, PDF (21/30 Pages) Texas Instruments – High-Perfomance, Fully-Differential AUDIO OP AMP

PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
PACKAGING INFORMATION
Orderable Device
OPA1632D
OPA1632DG4
OPA1632DGN
OPA1632DGNG4
OPA1632DGNR
OPA1632DGNRG4
OPA1632DR
OPA1632DRG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
SOIC
D
8
75 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
8
75 Green (RoHS
& no Sb/Br)
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS
& no Sb/Br)
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS
& no Sb/Br)
ACTIVE MSOP-
DGN 8 2500 Green (RoHS
PowerPAD
& no Sb/Br)
ACTIVE MSOP-
DGN 8 2500 Green (RoHS
PowerPAD
& no Sb/Br)
ACTIVE
SOIC
D
8 2500 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
8 2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU |
CU NIPDAUAG
CU NIPDAU
CU NIPDAU |
CU NIPDAUAG
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
OPA
1632
OPA
1632
1632
1632
1632
1632
OPA
1632
OPA
1632
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1