OPA1622 Datasheet, PDF (4/36 Pages) Texas Instruments – OPA1622 SoundPlus™ High-Fidelity, Bipolar-Input, Audio Operational Amplifier

OPA1622
SBOS727A – NOVEMBER 2015 – REVISED NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Current
Temperature
Supply voltage, V_S = (V+) – (V–)
Input voltage (Signal Inputs, Enable, Ground)
Input differential voltage
Input current (all pins except power-supply pins)
Output short-circuit⁽²⁾
Operating, T_A
Junction, T_J
Storage, T_stg
MIN
(V–) – 0.5
–55
–65
MAX
40
(V+) + 0.5
±0.5
±10
Continuous
125
200
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to V_S / 2 (ground in symmetrical dual supply setups), one amplifier per package.
6.2 ESD Ratings
V_(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Electrostatic discharge _{Charged-device model (CDM), per JEDEC specification JESD22-C101(2)}
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage (V+ – V–)
4 (±2)
Specified temperature
–40
NOM
MAX
36 (±18)
125
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA1622
DRC (SON)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
47.6
°C/W
58.1
°C/W
22.0
°C/W
0.9
°C/W
22.2
°C/W
4.1
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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