OPA1622 Datasheet, PDF (26/36 Pages) Texas Instruments – OPA1622 SoundPlus™ High-Fidelity, Bipolar-Input, Audio Operational Amplifier

OPA1622
SBOS727A – NOVEMBER 2015 – REVISED NOVEMBER 2015
www.ti.com
9 Power Supply Recommendations
The OPA1622 op amp operates from ±2-V to ±18-V supplies, while maintaining excellent performance. However,
some applications do not require equal positive and negative output voltage swing. With the OPA1622, power-
supply voltages do not need to be equal. For example, the positive supply could be set to +25 V with the
negative supply at –5 V.
In all cases, the common-mode voltage must be maintained within the specified range. Key parameters are
specified over the temperature range of T_A = –40°C to +125°C. Parameters that vary with operating voltage or
temperature are shown in the Typical Characteristics.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
• Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply
applications. The bypass capacitors are used to reduce the coupled noise by providing low-impedance power
sources local to the analog circuitry, because noise can propagate into analog circuitry through the power
pins of the circuit as a whole and the op amp specifically.
• Connect the IC ground pin to a low-impedance, low-noise, system reference point, such as an analog ground.
• Place the external components as close to the device as possible. As shown in Figure 60, keep feedback
resistors close to the inverting input to minimize parasitic capacitance and the feedback loop area.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• For proper amplifier function, connect the package thermal pad to the most negative supply voltage (VEE).
10.2 Layout Example
Place bypass
capacitors as close to
IC as possible
IN-
IN+
GND
IC ground pin
connected to low-
impedance, low-noise
system ground
VEE
+IN
V+
GND
V±
+IN
-IN
±
A
OUT
EN
B
±
OUT
-IN
Place feedback
resistors to minimize
feedback loop area
OUT
ENABLE
OUT
GND
VEE
Copper pour for thermal
pad must be connected to
negative supply (VEE)
IN+
IN-
Figure 60. Operational Amplifier Board Layout for a Difference Amplifier Configuration
26
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