OPA1612-Q1 Datasheet, PDF (4/31 Pages) Texas Instruments – SoundPlus High-Performance, Bipolar-Input Audio Operational Amplifier

OPA1612-Q1
SLOS931A – NOVEMBER 2015 – REVISED NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S ⁽²⁾
T_A
T_J
T_stg
Supply voltage
Input voltage
Input current (all pins except power-supply pins)
Output short-circuit⁽²⁾
Operating temperature
Junction temperature
Storage temperature
MIN
MAX
40
(V–) – 0.5
(V+) + 0.5
±10
Continuous
–55
125
200
–65
150
UNIT
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to V_S / 2 (ground in symmetrical dual supply setups), one amplifier per package.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±3000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+ – V–)
Specified temperature
MIN
4.5 (±2.25)
–40
NOM
MAX
36 (±18)
85
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA1612-Q1
D (SOIC)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
111.9
26.5
0.8
20.9
1.6
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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