MSP430F417-DIE Datasheet, PDF (4/6 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430F417-DIE
SLAS891 – JULY 2012
DESCRIPTION
P1.5/TA0CLK/ACLK
P1.4/TA1.0
P1.3/TA1.0/SVSOUT
P1.2/TA0.1
P1.1/TA0.0/MCLK
P1.0/TA0.0
TDO/TDI
TDI/TCLK
TMS
TCK
RST/NMI
P6.0
P6.1
P6.2
AVSS1
DVSS
AVCC
Table 1. Bond Pad Coordinates in Microns (continued)
PAD NUMBER
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
X MIN
2681.55
2456.25
2350
2245.35
2092
1991
1803.2
1401.45
1209.6
1105.85
1003.75
842.45
721.45
600.45
475.95
373.75
260.9
Y MIN
2464.1
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2766.8
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
2781.15
X MAX
2756.55
2531.25
2425
2320.35
2167
2066
1878.2
1476.45
1284.6
1180.85
1078.75
917.45
796.45
675.45
550.95
448.75
335.9
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Y MAX
2539.1
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2841.8
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
2856.15
4
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