LP3905 Datasheet, PDF (4/24 Pages) National Semiconductor (TI) – Power Management Unit For Low Power Handheld Applications

LP3905
SNVS374D – JUNE 2006 – REVISED MAY 2013
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Absolute Maximum Ratings⁽¹⁾⁽²⁾
V_IN1,V_IN2
FB1, FB2, EN1,EN2
Continuous Power Dissipation⁽³⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering, 10 sec.)
ESD Rating⁽⁴⁾
Human Body Model
−0.2V to 6.0V
(GND−0.2V) to
(V_IN + 0.2V) to 6.0V (max)
Internally Limited
+150°C
−65°C to +150°C
260°C
2.5kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Internal thermal shutdown circuitry protects the device from permanent damage.
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. MIL-STD-883 3015.7
Operating Ratings⁽¹⁾⁽²⁾
V_IN1 (Buck1 and 2 Input Voltage),V_IN2 (LDO1 and 2 Input Voltage)⁽³⁾
Recommended Load Current (Buck)
3V to 5.5V
0mA to 600 mA
Recommended Load Current (LDO)
0mA to 100mA with 0.47uF O/P cap
0mA to 150mA with 1.0uF O/P cap
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range⁽⁴⁾
−40°C to +125°C
−40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) V_IN1 and V_IN2 should be tied together at all times for proper Power Up
(4) In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have
to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX), the
maximum power dissipation of the device in the application (P_D-MAX) and the junction to ambient thermal resistance of the package (θ_JA)
in the application, as given by the following equation:T_A-MAX= T_J-MAX− (θ_JAx P_D-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance (θ_JA) NHL0014B package⁽¹⁾
37.3ºC/W
(1) Junction to ambient thermal resistance is highly dependent on board layout, PCB material environmental conditions and applications. In
applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. The use of
thermal vias under the pad may be required. For more on these topics, please refer to the Application Note: AN-1187: Leadless
leadframe Package (LLP) SNOA401.
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