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LP38852-ADJ Datasheet, PDF (4/31 Pages) Texas Instruments – 1.5-A Fast-Response High-Accuracy Adjustable LDO Linear Regulator
LP38852-ADJ
SNVS482F – JANUARY 2007 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
VIN supply voltage (survival)
VBIAS supply voltage (survival)
VSS soft-start voltage (survival)
VOUT voltage (survival)
IOUT current (survival)
Junction temperature
Power dissipation(3)
Storage temperature, Tstg
MIN
MAX
−0.3
6
−0.3
6
−0.3
6
−0.3
6
Internally Limited
−40
150
Internally Limited
−65
150
UNIT
V
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.
(3) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application and Implementation section for details.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VIN supply voltage (survival)
VBIAS supply voltage (survival)(1)
VEN voltage
IOUT
Junction temperature(2)
0.8 V ≤ VOUT ≤ 1.2 V
1.2 V < VOUT ≤ 1.8 V
MIN
NOM
MAX UNIT
(VOUT + VDO) to VBIAS
V
3
5.5
V
4.5
5.5
V
0
VBIAS
V
0
3
mA
−40
125
°C
(1) VIN cannot exceed either VBIAS or 4.5 V, whichever value is lower.
(2) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction-to-
ambient thermal resistance (RθJA). Additional heat sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application and Implementation section for details.
4
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