LP2989 Datasheet, PDF (4/34 Pages) National Semiconductor (TI) – Micropower/Low Noise, 500 mA Ultra Low-Dropout Regulator For Use with Ceramic Output Capacitors

LP2989
SNVS083O – FEBRUARY 2005 – REVISED MARCH 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
If Military/Aerospace specified devices are required contact the Texas Instruments Sales Office/Distributors for availability and
specifications. ⁽¹⁾
MIN
MAX
UNIT
Operating junction temperature
Power dissipation⁽²⁾
–40
125
°C
Internally Limited
Input supply voltage Survival
–0.3
16
V
SENSE pin
Output voltage
Survival ⁽³⁾
–0.3
6
V
–0.3
16
V
I_OUT (Survival)
Input-output voltage
Survival ⁽⁴⁾
Short-circuit protected
–0.3
16
V
Storage temperature range, T_stg
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum allowable power dissipation is a function of the maximum junction temperature, T_J(MAX), the junction-to-ambient thermal
resistance, R_θJA, and the ambient temperature, T_A. The maximum allowable power dissipation at any ambient temperature is calculated
using: P_(MAX) = (T_J(MAX) – T_A) / R_θJA. The value R_θJA for the WSON (NGN) package is specifically dependent on PCB trace area, trace
material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,
refer to Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
(3) If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2989 output must be diode-clamped to
ground.
(4) The output PNP structure contains a diode between the IN and OUT pins that is normally reverse-biased. Forcing the output above the
input will turn on this diode and may induce a latch-up mode which can damage the part.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
4
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