LP2989 Datasheet, PDF (2/34 Pages) National Semiconductor (TI) – Micropower/Low Noise, 500 mA Ultra Low-Dropout Regulator For Use with Ceramic Output Capacitors

LP2989
SNVS083O – FEBRUARY 2005 – REVISED MARCH 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description................................................. 14
7.4 Device Functional Modes........................................ 15
8 Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Application ................................................. 16
9 Power Supply Recommendations...................... 20
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Example .................................................... 20
11 Device and Documentation Support ................. 21
11.1 Documentation Support ....................................... 21
11.2 Trademarks ........................................................... 21
11.3 Electrostatic Discharge Caution ............................ 21
11.4 Glossary ................................................................ 21
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
Changes from Revision N (December 2014) to Revision O
Page
• Changed 30-V to 16-V ........................................................................................................................................................... 1
• Deleted trademark symbol from VIP which is no longer trademarked .................................................................................. 1
• Changed pin names to TI nomenclature; references to National to TI; add notes to Typical Application on first page;
fix errors in EC table reformat; replace Handling Ratings with ESD Ratings; take out Output Voltage Options and
add graphic to Mechanical section; changed LLP package name references to WSON; added overbar to
SHUTDOWN pin references; fix ulink for LP2989LV references. .......................................................................................... 1
• Changed description of N/C pin; add description of Thermal Pad; change "Ground" to "Thermal Pad" for NGN
drawing .................................................................................................................................................................................. 3
• Changed reference to National to TI ..................................................................................................................................... 4
• Deleted "Operating" row from Input supply voltage; thermal values from footnote 2 ............................................................ 4
• Changed 1.6 to 16 in ROC input supply voltage ................................................................................................................... 5
• Added word "OFF" ................................................................................................................................................................. 6
• Changed "high" to "low" ....................................................................................................................................................... 14
• Changed wording of "Operation with Shutdown Control" subsection ................................................................................. 15
• Changed V_ON/OFF to V_SD ....................................................................................................................................................... 15
• Changed "guaranteed" to "ensured" in "CAUTION". ............................................................................................................ 15
• Changed V_ON/OFF to V_SD ....................................................................................................................................................... 15
• Changed wording of last sentence of introductory Detailed Design Procedure paragraph ................................................ 17
• Changed words "size" and "amount" for capacitors to "value" ............................................................................................ 17
• Changed wording of first sentence, second paragraph of Noise Bypass Capacitor subsection ......................................... 18
• Added Documentation Support section ............................................................................................................................... 21
Changes from Revision M (February 2005) to Revision N
Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section; add updated Thermal Information
values .................................................................................................................................................................................... 1
2
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