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LMC6482_15 Datasheet, PDF (4/39 Pages) Texas Instruments – CMOS Dual Rail-to-Rail Input and Output Operational Amplifier
LMC6482
SNOS674E – NOVEMBER 1997 – REVISED APRIL 2015
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6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
VALUE
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
Supply Voltage
Junction Temperature Range
LMC6482AM
LMC6482AI, LMC6482I
MIN
MAX
UNIT
3
15.5
V
–55
125
°C
–40
−85
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.4 Thermal Information
THERMAL METRIC(1)
LMC6482
D (SOIC)
LMC6482
DGK (VSSOP)
LMC6482
P (PDIP)
UNIT
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
155
194
90
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics for V+ = 5 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 5 V, V− = 0 V, VCM = VO = V+/2 and RL > 1 M.
PARAMETER
TEST CONDITIONS
TJ = 25°C
MIN TYP(2)
MAX (3)
At Temperature
Extremes (1)
MIN TYP(2) MAX(3)
DC Electrical Characteristics
VOS
Input Offset
Voltage
LMC6482AI
LMC6482I
LMC6482M
0.11 0.75
1.35
0.11
3
3.7
0.11
3
3.8
TCVOS Input Offset
1
Voltage
Average Drift
LMC6482AI
0.02
4
IB
Input Current See (4)
LMC6482I
0.02
4
LMC6482M
0.02
10
LMC6482AI
0.01
2
IOS
Input Offset
Current
See (4)
LMC6482I
0.01
2
LMC6482M
0.01
5
CIN
Common-
3
Mode Input
Capacitance
RIN
Input
10
Resistance
UNIT
mV
μV/°C
pA
pA
pF
TeraΩ
(1) See Recommended Operating Conditions for operating temperature ranges.
(2) Typical Values represent the most likely parametric norm.
(3) All limits are specified by testing or statistical analysis.
(4) Ensured limits are dictated by tester limitations and not device performance. Actual performance is reflected in the typical value.
4
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