LM5022-Q1 Datasheet, PDF (4/37 Pages) Texas Instruments – 60 V Low-Side Controller For Boost and SEPIC

LM5022-Q1
SNVSAG9 – MARCH 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
VIN to GND
VCC to GND
RT/SYNC to GND
OUT to GND
All other pins to GND
Power dissipation
Junction temperature⁽³⁾
Soldering information
Vapor phase (60 sec.)
Infrared (15 sec.)
Storage temperature, T_stg
MIN
MAX
–0.3
65
–0.3
16
–0.3
5.5
–1.5V for < 100 ns
–0.3
7
Internally limited
150
215
220
–65
150
UNIT
V
V
V
V
°C
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.2 ESD Ratings: LM5022-Q1
V_(ESD)
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011⁽²⁾
VALUE
±2000
±750
UNIT
V
V
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. This is the passing
level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD
control process
(2) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
External voltage at V_CC
Junction temperature
MIN
NOM
MAX UNIT
6
60
V
7.5
14
V
–40
125
°C
(1) Operating Ratings are conditions under the device is intended to be functional. For specifications and test conditions, see Electrical
Characteristics
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LM5022-Q1
DGS (VSSOP)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
161.5
56
81.3
5.7
80
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: LM5022-Q1
Copyright © 2016, Texas Instruments Incorporated