HD3SS0001 Datasheet, PDF (4/8 Pages) Texas Instruments – 10.3Gbps Thunderbolt™ and DisplayPort™ Switch

HD3SS0001
SLAS827 – FEBRUARY 2012
PIN
NUMBER
NAME
11
LSTx
12
LSRx
10
S0
13
DP_EN
14
10G_EN
1, 15, 24
VDD
4, 7, 18, 21,
Center Pad
GND
PIN FUNCTIONS (continued)
I/O
DESCRIPTION
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I/O Controller Side UART TX SignalController Side UART RX Signal
I
Supply
Control Lines for configuring device. S0 and 10G_EN incorporate integrated pulldowns and
DP_EN incorporates a pullup. Therefore, the default device state will be “Detect Mode” per the
Truth Table provided these lines are not driven.
Positive power supply voltage
Supply Negative power supply voltage
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range (unless otherwise noted)
Supply voltage
range ⁽²⁾
V_DD
Voltage range
Electrostatic
discharge
Differential I/O
Control pin/buffers
Human body model⁽³⁾
Charged-device model⁽⁴⁾
Continuous power dissipation
VALUE
MIN
MAX
UNIT
–0.5
4
V
–0.5
4
V
–0.5
VDD+0.5
±1,500
V
±500
See Thermal Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC/ESDA JS-001-2011
(4) Tested in accordance with JEDEC JESD22 C101-E
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JCbot
θ_JB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
HD3SS0001
28-PIN TQFN (RLF)
37.9
34.4
1.4
8.7
0.6
8.5
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP MAX⁽¹⁾ UNIT
P_D
P_(Detect)
P_Sleep
Device power dissipation
Device power dissipation in detect mode
Device power dissipation in sleep mode
4.6
7.6 mW
5 mW
15 µW
(1) The maximum rating is simulated under 3.6V VDD.
4
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