DRV8837C Datasheet, PDF (4/21 Pages) Texas Instruments – 1-A Low-Voltage H-Bridge Driver

DRV8837C
SLVSD61A – JULY 2016 – REVISED JULY 2016
6 Specifications
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6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
Motor power-supply voltage VM
Logic power-supply voltage
Control pin voltage
V_CC
IN1, IN2, nSLEEP
Peak drive current
OUT1, OUT2
Operating virtual junction temperature, T_J
Storage temperature, T_stg
MIN
MAX
–0.3
12
–0.3
7
–0.5
7
Internally limited
–40
150
–60
150
UNIT
V
V
V
A
ºC
ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±4000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
V_VM
V_CC
I_OUT
f_PWM
V_LOGIC
T_A
Motor power-supply voltage
Logic power-supply voltage
Motor peak current
Externally applied PWM frequency
Logic level input voltage
Operating ambient temperature
MIN
MAX
UNIT
0
11
V
1.8
7
V
0
1
A
0
250
kHz
0
5.5
V
–40
85
°C
6.4 Thermal Information
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC ⁽¹⁾
DRV8837C
DSG (WSON)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
60.9
°C/W
71.4
°C/W
32.2
°C/W
1.6
°C/W
32.8
°C/W
9.8
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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