CC2540F128_14 Datasheet, PDF (4/36 Pages) Texas Instruments – 2.4-GHz Bluetooth low energy System-on-Chip

CC2540F128, CC2540F256
SWRS084F – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Supply voltage
All supply pins must have the same voltage
Voltage on any digital pin
Input RF level
Storage temperature range
ESD ⁽²⁾
All pads, according to human-body model, JEDEC STD 22, method A114
According to charged-device model, JEDEC STD 22, method C101
MIN
MAX UNIT
–0.3
3.9 V
–0.3 VDD + 0.3,
≤ 3.9
V
10 dBm
–40
125 °C
2 kV
750 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
Operating ambient temperature range, T_A
Operating supply voltage
MIN MAX UNIT
–40
85 °C
2
3.6 V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2540 EM reference design with T_A = 25°C and VDD = 3 V
PARAMETER
TEST CONDITIONS
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and
sleep timer active; RAM and register retention
I_core Core current consumption
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep
timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
Low MCU activity: 32-MHz XOSC running. No radio or
peripherals. No flash access, no RAM access.
Timer 1. Timer running, 32-MHz XOSC used
Timer 2. Timer running, 32-MHz XOSC used
Peripheral current consumption
Timer 3. Timer running, 32-MHz XOSC used
I_peri
(Adds to core current I_core for each
peripheral unit activated)
Timer 4. Timer running, 32-MHz XOSC used
Sleep timer, including 32.753-kHz RCOSC
ADC, when converting
MIN TYP MAX UNIT
235
0.9
µA
0.4
6.7
mA
90
μA
90
μA
60
μA
70
μA
0.6
μA
1.2
mA
4
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