CC2540F128_14 Datasheet, PDF (24/36 Pages) Texas Instruments – 2.4-GHz Bluetooth low energy System-on-Chip

CC2540F128, CC2540F256
SWRS084F – OCTOBER 2010 – REVISED JUNE 2013
APPLICATION INFORMATION
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Few external components are required for the operation of the CC2540. A typical application circuit is shown in
Figure 22.
32-kHz Crystal⁽¹⁾
2-V to 3.6-V Power Supply
C401
C331
C321
1 DGND_USB
2 USB_P
3 USB_N
4 DVDD_USB
5 P1_5
6 P1_4
7 P1_3
8 P1_2
9 P1_1
10 DVDD2
CC2540
DIE ATTACH PAD
RBIAS 30
AVDD4 29
AVDD1 28
AVDD2 27
RF_N 26
RF_P 25
AVDD3 24
XOSC_Q2 23
XOSC_Q1 22
AVDD5 21
R301
L251
C251
C252
C261
L261
C262
Antenna
(50 W)
L252
L253
C253
Power Supply Decoupling Capacitors are Not Shown
Digital I/O Not Connected
C221
XTAL1
C231
(1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby
state (Vol. 6 Part B Section 1.1 in [1]).
NOTE: Different antenna alternatives will be provided as reference designs.
Figure 22. CC2540 Application Circuit
S0383-03
Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors)
Component
C221
C231
C251
C252
C253
C261
C262
C321
C331
Description
32-MHz xtal loading capacitor
32-MHz xtal loading capacitor
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
32-kHz xtal loading capacitor
32-kHz xtal loading capacitor
Value
12 pF
12 pF
18 pF
1 pF
1 pF
18 pF
1 pF
15 pF
15 pF
24
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