BQ2947_16 Datasheet, PDF (4/24 Pages) Texas Instruments – Overvoltage Protection for 2-Series to 4-Series Cell Li-Ion Batteries

bq2947
SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016
7 Specifications
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7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage range VDD–VSS
Input voltage range
V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS
Output voltage range OUT–VSS
Continuous total power dissipation, P_TOT
Lead temperature (soldering, 10 s), T_SOLDER
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
30
V
–0.3
30
V
–0.3
30
V
See Thermal Information
300
°C
–65
150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
Over-operating free-air temperature range (unless otherwise noted)
Supply voltage, V_DD
Input voltage range
V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS
Operating ambient temperature range, T_A
MIN
NOM
MAX UNIT
3
20
V
0
5
V
–40
110
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq2947
SON
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
62
72
32.5
°C/W
1.6
33
10
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
4
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