BQ294602_17 Datasheet, PDF (4/21 Pages) Texas Instruments – Single-Cell Protector for Li-Ion Batteries

bq294602, bq294604, bq294682, bq294624
SLUSAS0D – DECEMBER 2011 – REVISED APRIL 2017
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Input voltage
Output voltage
Continuous total power dissipation, P_TOT
Functional temperature
Lead temperature (soldering, 10 s), T_SOLDER
Storage temperature, T_stg
VDD–VSS
V1–VSS
OUT–VSS
MIN
MAX
–0.3
30
–0.3
8
–0.3
30
See Thermal
Information
–65
110
300
–65
150
UNIT
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V_DD(1)
Input voltage
V1–VSS
Operating ambient temperature, T_A
(1) See Typical Application.
MIN
MAX
UNIT
3
8
V
0
5
V
–40
110
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq2946xx
DRV (SON)
UNIT
6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
186.4
90.4
110.7
96.7
90
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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