BQ27546-G1 Datasheet, PDF (4/38 Pages) Texas Instruments – nullSingle-Cell Li-Ion Battery Fuel Gauge

bq27546-G1
SLUSC53A – MAY 2015 – REVISED DECEMBER 2015
8 Specifications
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8.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_I
V_CC
V_IOD
V_BAT
V_I
T_A
T_F
T_stg
Regulator input, REGIN
Supply voltage range
Open-drain I/O pins (SDA, SCL, HDQ)
BAT input (pin E2)
Input voltage range to all others (pins GPIO, SRP, SRN, TS)
Operating free-air temperature range
Functional temperature range
Storage temperature range
MIN
MAX
UNIT
–0.3
5.5
V
–0.3
2.75
V
–0.3
5.5
V
–0.3
5.5
V
–0.3
–40
V_CC + 0.3
V
85
°C
–40
100
°C
–65
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
V_(ESD)
Electrostatic Discharge
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾, BAT pin
Human Body Model (HBM), all pins
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
1500
2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
V
8.3 Recommended Operating Conditions
T_A = –40°C to 85°C; typical values at T_A = 25°C and V_REGIN = V_BAT = 3.6 V (unless otherwise noted)
MIN NOM
No operating restrictions
2.8
V_I
Supply voltage, REGIN
No FLASH writes
2.45
C_REGIN
C_LDO25
t_PUCD
External input capacitor for internal LDO
between REGIN and V_SS
Nominal capacitor values specified.
Recommend a 5% ceramic X5R type capacitor
External output capacitor for internal LDO _{located close to the device.}
between V_CC an V_SS
Power-up communication delay
0.1
0.47
1
250
MAX
4.5
2.8
UNIT
V
µF
µF
ms
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq27546-G1
YZF (DSBGA)
UNIT
15 PINS
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
70
17
20
°C/W
1
18
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
4
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