AMC1306E05_17 Datasheet, PDF (4/40 Pages) Texas Instruments – Small, High-Precision, Reinforced Isolated Delta-Sigma Modulators with High CMTI

AMC1306E05, AMC1306E25, AMC1306M05, AMC1306M25
SBAS734 – MARCH 2017
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
MIN
MAX
UNIT
Supply voltage
AVDD to AGND or DVDD to DGND
–0.3
6.5
V
Analog input voltage at AINP, AINN
AGND – 6
AVDD + 0.5
V
Digital input or output voltage at CLKIN or DOUT
DGND – 0.5
DVDD + 0.5
V
Input current to any pin except supply pins
–10
10
mA
Junction temperature, T_J
Storage temperature, T_stg
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
AVDD
DVDD
T_A
Analog (high-side) supply voltage (AVDD to AGND)
Digital (controller-side) supply voltage (DVDD to DGND)
Operating ambient temperature
MIN
NOM
MAX
UNIT
3.0
5.0
5.5
V
2.7
3.3
5.5
V
–40
125
°C
7.4 Thermal Information
THERMAL METRIC ⁽¹⁾
AMC1306x
DWV (SOIC)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
112.2
47.6
60.0
23.1
60.0
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Power Ratings
PARAMETER
TEST CONDITIONS
AMC1306Ex, AVDD = DVDD = 5.5 V
P_D
Maximum power dissipation (both sides)
AMC1306Mx, AVDD = DVDD = 5.5 V
P_D1
Maximum power dissipation
(high-side supply)
AVDD = 5.5 V
P_D2
Maximum power dissipation
(low-side supply)
AMC1306Ex, DVDD = 5.5 V
AMC1306Mx, DVDD = 5.5 V
MIN
TYP
MAX UNIT
91.85
mW
86.90
53.90 mW
37.95
mW
33.00
4
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