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AMC1204_1108 Datasheet, PDF (4/30 Pages) Texas Instruments – 20MHz, Second-Order, Isolated Delta-Sigma Modulator for Current-Shunt Measurement
AMC1204
SBAS512B – APRIL 2011 – REVISED AUGUST 2011
ISOLATION CHARACTERISTICS
PARAMETER
TEST CONDITIONS
VIORM
Maximum working insulation voltage
per IEC
VPD(t)
VIOTM
Partial discharge test voltage per IEC t = 1s (100% production test), partial discharge < 5pC
Transient overvoltage
t = 60s (qualification test)
t = 1s (100% production test)
RS
Isolation resistance
PD
Pollution degree
VIO = 500V at TS
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VALUE
1200
2250
4000
4000
> 109
2
UNIT
VPEAK
VPEAK
VPEAK
VPEAK
Ω
Degrees
ISOLATOR CHARACTERISTICS(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
L(I01) Minimum air gap (clearance)
Shortest terminal to terminal distance
through air
7.9
mm
L(I02) Minimum external tracking (creepage)
Shortest terminal to terminal distance
across the package surface
7.9
mm
CTI
Tracking resistance
(comparative tracking index)
DIN IEC 60112/VDE 0303 part 1
≥ 175
V
Minimum internal gap
(internal clearance)
Distance through the insulation
0.014
mm
RIO Isolation resistance
CIO Barrier capacitance input to output
CI
Input capacitance to ground
Input to output, VIO = 500V, all pins on
each side of the barrier tied together to
create a two-terminal device, TA < +85°C
Input to output, VIO = 500V,
+100°C ≤ TA < TA max
VI = 0.8VPP at 1MHz
VI = 0.8VPP at 1MHz
> 1012
Ω
> 1011
Ω
1.2
pF
3
pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of a specific
application. Care should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting
pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal
according to the measurement techniques shown in the Isolation Glossary section. Techniques such as inserting grooves and/or ribs on
the PCB are used to help increase these specifications.
4
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