THS3091 Datasheet, PDF (37/45 Pages) Texas Instruments – HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS

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THS3091, THS3095
SLOS423H – SEPTEMBER 2003 – REVISED DECEMBER 2015
9 Power Supply Recommendations
The THS3091 can operate off a single supply or with dual supplies as long as the input CM voltage range
(CMIR) has the required headroom to either supply rail. Operating from a single supply can have numerous
advantages. With the negative supply at ground, the DC errors due to the –PSRR term can be minimized.
Supplies should be decoupled with low inductance, often ceramic, capacitors to ground less than 0.5 inches from
the device pins. The use of ground plane is recommended, and as in most high speed devices, it is advisable to
remove ground plane close to device sensitive pins such as the inputs. An optional supply decoupling capacitor
across the two power supplies (for split supply operation) improves second harmonic distortion performance.
10 Layout
10.1 Layout Guidelines
Achieving optimum performance with a high-frequency amplifier, like the THS309x, requires careful attention to
board layout parasitic and external component types.
Recommendations that optimize performance include:
• Minimize parasitic capacitance to any ac ground for all of the signal I/O pins. Parasitic capacitance on the
output and input pins can cause instability. To reduce unwanted capacitance, a window around the signal I/O
pins should be opened in all of the ground and power planes around those pins. Otherwise, ground and
power planes should be unbroken elsewhere on the board.
• Minimize the distance [< 0.25 inch (6.35 mm)] from the power supply pins to high-frequency 0.1-μF and 100-
pF decoupling capacitors. At the device pins, the ground and power plane layout should not be in close
proximity to the signal I/O pins. Avoid narrow power and ground traces to minimize inductance between the
pins and the decoupling capacitors. The power supply connections should always be decoupled with these
capacitors. Larger (6.8 μF or more) tantalum decoupling capacitors, effective at lower frequency, should also
be used on the main supply pins. These may be placed somewhat farther from the device and may be shared
among several devices in the same area of the PC board.
• Careful selection and placement of external components preserve the high-frequency performance of the
THS309x. Resistors should be a low reactance type. Surface-mount resistors work best and allow a tighter
overall layout. Again, keep their leads and PC board trace length as short as possible. Never use wire-bound
type resistors in a high-frequency application. Because the output pin and inverting input pins are the most
sensitive to parasitic capacitance, always position the feedback and series output resistors, if any, as close as
possible to the inverting input pins and output pins. Other network components, such as input termination
resistors, should be placed close to the gain-setting resistors. Even with a low parasitic capacitance shunting
the external resistors, excessively high resistor values can create significant time constants that can degrade
performance. Good axial metal-film or surface-mount resistors have approximately 0.2 pF in shunt with the
resistor. For resistor values > 2 kΩ, this parasitic capacitance can add a pole and/or a zero that can effect
circuit operation. Keep resistor values as low as possible, consistent with load-driving considerations.
• Connections to other wideband devices on the board may be made with short direct traces or through
onboard transmission lines. For short connections, consider the trace and the input to the next device as a
lumped capacitive load. Relatively wide traces [0.05 inch (1.3 mm) to 0.1 inch (2.54 mm)] should be used,
preferably with ground and power planes opened up around them. Estimate the total capacitive load and
determine if isolation resistors on the outputs are necessary. Low parasitic capacitive loads (< 4 pF) may not
need an R_S because the THS309x are nominally compensated to operate with a 2-pF parasitic load. Higher
parasitic capacitive loads without an RS are allowed as the signal gain increases (increasing the unloaded
phase margin). If a long trace is required, and the 6-dB signal loss intrinsic to a doubly terminated
transmission line is acceptable, implement a matched impedance transmission line using microstrip or
stripline techniques (consult an ECL design handbook for microstrip and stripline layout techniques). A 50-Ω
environment is not necessary onboard, and in fact, a higher impedance environment improves distortion as
shown in the distortion versus load plots. With a characteristic board trace impedance based on board
material and trace dimensions, a matching series resistor into the trace from the output of the THS309x is
used as well as a terminating shunt resistor at the input of the destination device. Remember also that the
terminating impedance is the parallel combination of the shunt resistor and the input impedance of the
destination device; this total effective impedance should be set to match the trace impedance. If the 6-dB
attenuation of a doubly terminated transmission line is unacceptable, a long trace can be series- terminated at
the source end only. Treat the trace as a capacitive load in this case. This does not preserve signal integrity
as well as a doubly terminated line. If the input impedance of the destination device is low, there is some
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