OPA454_16 Datasheet, PDF (33/47 Pages) Texas Instruments – High-Voltage (100-V), High-Current (50-mA) Operational Amplifiers

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OPA454
SBOS391B – DECEMBER 2007 – REVISED MARCH 2016
11 Power Supply Recommendations
The OPA454 may be operated from power supplies up to ±50 V or a total of 100 V with excellent performance.
Most behavior remains unchanged throughout the full operating voltage range. Parameters that vary significantly
with operating voltage are shown in Typical Characteristics.
Some applications do not require equal positive and negative output voltage swing. Power-supply voltages do
not need to be equal. The OPA454 can operate with as little as 10 V between the supplies and with up to 100 V
between the supplies. For example, the positive supply could be set to 90 V with the negative supply at –10 V, or
vice-versa (as long as the total is less than or equal to 100 V).
12 Layout
12.1 Layout Guidelines
12.1.1 Thermally-Enhanced PowerPAD Package
The OPA454 comes in an 8-pin SO with PowerPAD version that provides an extremely low thermal resistance
(θ_JC) path between the die and the exterior of the package. This package features an exposed thermal pad. This
thermal pad has direct thermal contact with the die; thus, excellent thermal performance is achieved by providing
a good thermal path away from the thermal pad.
The OPA454 SO-8 PowerPAD is a standard-size SO-8 package constructed using a downset leadframe upon
which the die is mounted, as Figure 84 shows. This arrangement results in the lead frame being exposed as a
thermal pad on the underside of the package. The thermal pad on the bottom of the IC can then be soldered
directly to the PCB, using the PCB as a heatsink. In addition, plated-through holes (vias) provide a low thermal
resistance heat flow path to the back side of the PCB. This architecture enhances the OPA454 power dissipation
capability significantly, eliminates the use of bulky heatsinks and slugs traditionally used in thermal packages,
and allows the OPA454 to be easily mounted using standard PCB assembly techniques.
NOTE
Because the SO-8 PowerPAD is pin-compatible with standard SO-8 packages, the
OPA454 is a drop-in replacement for operational amplifiers in existing sockets. Soldering
the PowerPAD to the PCB is always required, even with applications that have low power
dissipation. Soldering the device to the PCB provides the necessary thermal and
mechanical connection between the leadframe die pad and the PCB.
Leadframe (Copper Alloy)
IC (Silicon)
Die Attach (Epoxy)
Mold Compound (Plastic)
Leadframe Die Pad
Exposed at Base of the Package
(Copper Alloy)
Figure 84. Cross-Section View of a PowerPAD Package
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