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MSP430F21X1_14 Datasheet, PDF (33/62 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER
MSP430F21x1
www.ti.com
SLAS439F – SEPTEMBER 2004 – REVISED AUGUST 2011
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
VCC (PGM/ERASE)
fFTG
IPGM
IERASE
tCPT
tCMErase
PARAMETER
Program and erase supply voltage
Flash timing generator frequency
Supply current from VCC during program
Supply current from VCC during erase
Cumulative program time(1)
Cumulative mass erase time
Program/erase endurance
TEST CONDITIONS
VCC
2.2 V/3.6 V
2.2 V/3.6 V
2.2 V/3.6 V
2.2 V/3.6 V
MIN TYP MAX UNIT
2.2
3.6 V
257
476 kHz
3
5 mA
3
7 mA
10 ms
20
104
105
ms
cycles
tRetention
tWord
tBlock, 0
tBlock, 1-63
tBlock, End
tMass Erase
tSeg Erase
Data retention duration
Word or byte program time
Block program time for first byte or word
Block program time for each additional
byte or word
Block program end-sequence wait time
Mass erase time
Segment erase time
TJ = 25°C
See (2)
See (2)
See (2)
See (2)
See (2)
See (2)
100
30
25
18
6
10593
4819
years
tFTG
tFTG
tFTG
tFTG
tFTG
tFTG
(1) The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
(2) These values are hardwired into the flash controller's state machine (tFTG = 1/fFTG).
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
V(RAMh)
PARAMETER
RAM retention supply voltage (1)
TEST CONDITIONS
MIN
CPU halted
1.6
MAX UNIT
V
(1) This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fTCK
TCK input frequency(1)
VCC
2.2 V
3V
MIN TYP
0
0
RInternal
Internal pulldown resistance on TEST
2.2 V/3 V
25
60
(1) fTCK may be restricted to meet the timing requirements of the module selected.
MAX
5
10
90
UNIT
MHz
MHz
kΩ
JTAG Fuse(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
VCC(FB)
VFB
IFB
tFB
PARAMETER
Supply voltage during fuse-blow condition
Voltage level on TEST for fuse blow
Supply current into TEST during fuse blow
Time to blow fuse
TA
25°C
25°C
25°C
25°C
MIN MAX UNIT
2.5
V
6
7V
100 mA
1 ms
(1) Once the fuse is blown, no further access to the JTAG/Test and emulation features is possible, and the JTAG block is switched to
bypass mode.
Copyright © 2004–2011, Texas Instruments Incorporated
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