LM3464 Datasheet, PDF (32/33 Pages) National Semiconductor (TI) – 4 Channel LED Driver Evaluation Board

PWP0028A
EXAMPLE STENCIL DESIGN
PowerPAD ^TM - 1.1 mm max height
PLASTIC SMALL OUTLINE
28X (1.5)
28X (0.45)
1
26X (0.65)
SYMM
(3)
BASED ON
0.127 THICK
STENCIL
METAL COVERED
BY SOLDER MASK
28
28X (0.45)
(5.5)
BASED ON
0.127 THICK
STENCIL
28X (1.3)
14
15
SYMM
(5.8)
IPC-7351 NOMINAL
0.65 CLEARANCE CREEPAGE
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
(6.1)
HV / ISOLATION OPTION
0.9 CLEARANCE CREEPAGE
OTHER DIMENSIONS IDENTICAL TO IPC-7351
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE AREA
SCALE:6X
STENCIL
THICKNESS
0.1
0.127
0.152
0.178
SOLDER STENCIL
OPENING
3.55 X 6.37
3.0 X 5.5 (SHOWN)
2.88 X 5.16
2.66 X 4.77
4214870/A 10/2014
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
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