LM3464 Datasheet, PDF (31/33 Pages) National Semiconductor (TI) – 4 Channel LED Driver Evaluation Board

PWP0028A
28X (1.5)
28X (0.45)
1
26X
(0.65)
(3.4)
NOTE 9
(3)
SOLDER
MASK
OPENING
EXAMPLE BOARD LAYOUT
PowerPAD ^TM - 1.1 mm max height
PLASTIC SMALL OUTLINE
SOLDER MASK
DEFINED PAD
28
28X (0.45)
28X (1.3)
SYMM
(5.5) (9.7)
SOLDER
MASK
OPENING
(1.3) TYP
14
15
SEE DETAILS
(1.3)
SYMM
(0.65) TYP
(5.8)
IPC-7351 NOMINAL
0.65 CLEARANCE CREEPAGE
( 0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
(0.9) TYP
(6.1)
HV / ISOLATION OPTION
0.9 CLEARANCE CREEPAGE
OTHER DIMENSIONS IDENTICAL TO IPC-7351
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NOTES: (continued)
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214870/A 10/2014
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
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