TLC374_15 Datasheet, PDF (3/26 Pages) Texas Instruments – LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS

TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
TLC374Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC374C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
(13)
(14)
65
(1)
(2)
BONDING PAD ASSIGNMENTS
(12) ₍₁₁₎
(10) (9)
(8)
(7)
(3)
(4)
90
(5) (6)
(7)
1IN +
VDD
(3)
+
(6)
1IN –
–
(2)
+
2OUT
–
3IN + ⁽⁹⁾ ₊
(8)
3IN –
–
(13)
+
4OUT
–
(12)
GND
(1)
1OUT
(5)
2IN +
(4)
2IN –
(14)
3OUT
(11)
4IN +
(10)
4IN –
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJMAX = 150°C
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS.
PIN (12) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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