TLC354_14 Datasheet, PDF (3/18 Pages) Texas Instruments – LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS

TLC354
LinCMOS™ QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS116B – SEPTEMBER 1985 – REVISED FEBRUARY 1997
TLC364Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC354C. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive
epoxy or a gold-silicon preform.
(13)
(14)
65
(1)
(2)
BONDING PAD ASSIGNMENTS
(12) (11)
(10) ₍₉₎
(8)
(7)
(3) ⁽⁴⁾
90
(5) ⁽⁶⁾
(7)
1IN +
VDD
(3)
+
(6)
1IN –
–
(2)
+
2OUT
–
3 IN + ⁽⁹⁾ ₊
(8)
3IN –
–
(13)
+
4OUT
–
(1)
1OUT
(5)
2IN +
(4)
2IN –
(14)
3OUT
(11)
4IN +
(10)
4IN –
(12)
VDD _– /GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJMAX = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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