TLC252_16 Datasheet, PDF (3/26 Pages) Texas Instruments – LinCMOS DUAL OPERATIONAL AMPLIFIERS

TLC252, TLC252A, TLC252B, TLC252Y, TLC25L2, TLC25L2A, TLC25L2B
TLC25L2Y, TLC25M2, TLC25M2A, TLC25M2B, TLC25M2Y
LinCMOS DUAL OPERATIONAL AMPLIFIERS
SLOS002I – JUNE 1983 – REVISED MARCH 2001
TLC252Y, TLC25L2Y, and TLC25M2Y chip information
These chips, properly assembled, display characteristics similar to the TLC252 / 25_2. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(5)
(6)
60
(7)
(4)
(3)
VDD
(8)
(3)
1IN +
+
(1)
(2)
1OUT
1IN –
–
(2)
(7)
+
(5)
2IN +
2OUT
(6)
–
2IN –
(4)
VDD _– /GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
(1)
(8)
TJMAX = 150°C
TOLERANCES ARE ± 10%.
73
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3