SLVS141A Datasheet, PDF (3/18 Pages) Texas Instruments – FIXED NEGATIVE 5-V 200-mA INVERTING DC/DC CONVERTER

TPS6735
FIXED NEGATIVE 5ĆV 200ĆmA INVERTING DC/DC CONVERTER
SLVS141A − JULY 1996 − REVISED JANUARY 1997
chip information
These chips, when properly assembled, display characteristics similar to the TPS6735. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
1
8
8
8
2
82
(1)
EN
(8) _VCC
(2)
REF
(3)
SS
TPS6735Y
(7)
OUT
(6)
GND
(4)
7
COMP
(5)
FB
7
3
4
75
6
5
5
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
Terminal Functions
TERMINAL
NAME
NO.
EN
1
REF
2
SS
3
COMP
4
FB
5
GND
6
OUT
7
VCC
8
DESCRIPTION
Enable. EN > 2 V turns on the TPS6735. EN ≤ 0.4 V turns it off.
1.22-V reference voltage output. REF can source 125 µA for external loads.
Soft start. A capacitor between SS and GND brings the output voltage up slowly.
Compensation. A capacitor to ground stabilizes the feedback loop.
Feedback. FB connects to the dc/dc converter output.
Ground
Power MOSFET drain connection
Supply-voltage input
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