LP38692MP-3.3 Datasheet, PDF (3/28 Pages) Texas Instruments – 1A Low Dropout CMOS Linear Regulators Stable with Ceramic Output Capacitors

LP38690, LP38692
www.ti.com
SNVS322J – DECEMBER 2004 – REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Storage Temperature Range
Lead Temp. (Soldering, 5 seconds)
ESD Rating⁽³⁾
Power Dissipation⁽⁴⁾
V(max) All pins (with respect to GND)
I_OUT ⁽⁵⁾
Junction Temperature
−65°C to +150°C
260°C
2 kV
Internally Limited
-0.3V to 12V
Internally Limited
−40°C to +150°C
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.
(4) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). The junction-to-ambient thermal resistance ( θ_J-A) for the PFM is approximately 90°C/W for a PC board mounting with
the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator
for the PFM, the θ_J-A drops to approximately 50°C/W. The SOT-223 package has a θ_J-A of approximately 125°C/W when soldered down
to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W when soldered to a copper area of one square inch.
The θ_J-A values for the WSON package are also dependent on trace area, copper thickness, and the number of thermal vias used (refer
to the TI AN-1187 Application Report and the WSON MOUNTING section in this datasheet). If power dissipation causes the junction
temperature to exceed specified limits, the device will go into thermal shutdown.
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
OPERATING RATINGS
V_IN Supply Voltage
Operating Junction Temperature Range
2.7V to 10V
−40°C to +125°C
ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for T_J = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V_IN = V_OUT + 1V, C_IN = C_OUT = 10 µF, I_LOAD = 10mA. Min/Max limits are specified through testing,
statistical correlation, or design.
Symbol
Parameter
Conditions
Min
Typ ⁽¹⁾
Max
Units
V_O
ΔV_O/ΔV_IN
ΔV_O/ΔI_L
V_IN - V_OUT
Output Voltage Tolerance
Output Voltage Line Regulation⁽²⁾
Output Voltage Load Regulation⁽³⁾
Dropout Voltage⁽⁴⁾
100 µA < I_L < 1A
V_O + 1V ≤ V_IN ≤ 10V
V_O + 0.5V ≤ V_IN ≤ 10V
I_L = 25mA
1 mA < I_L < 1A
V_IN = V_O + 1V
(V_O = 1.8V)
I_L = 1A
(V_O = 2.5V)
I_L = 0.1A
I_L = 1A
(V_O = 3.3V)
I_L = 0.1A
I_L = 1A
(V_O = 5V)
I_L = 0.1A
I_L = 1A
-2.5
2.5
-5.0
5.0
%V_OUT
0.03
0.1
%/V
1.8
5
%/A
950
1600
80
145
800
1300
mV
65
110
650
1000
45
100
450
800
(1) Typical numbers represent the most likely parametric norm for 25°C operation.
(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to
full load.
(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.
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