LP38513-ADJ Datasheet, PDF (3/18 Pages) National Semiconductor (TI) – 3A Fast-Transient Response Adjustable Low-Dropout Linear Voltage Regulator

LP38513-ADJ
www.ti.com
SNVS514C – JANUARY 2009 – REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾
Storage Temperature Range
Soldering Temperature ⁽²⁾
−65°C to +150°C
Thin TO-263
ESD Rating ⁽³⁾
Power Dissipation ⁽⁴⁾
260°C, 10s
±2 kV
Internally Limited
Input Pin Voltage (Survival)
-0.3V to +6.0V
Enable Pin Voltage (Survival)
-0.3V to +6.0V
Output Pin Voltage (Survival)
-0.3V to +6.0V
ADJ Pin Voltage (Survival)
-0.3V to +6.0V
I_OUT (Survival)
Internally Limited
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperatures and times are for Sn-Pb (STD) only.
(3) The human body model (HBM) is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD22-
A114.
(4) Device operation must be evaluated, and derated as needed, based on ambient temperature (T_A), power dissipation (P_D), maximum
allowable operating junction temperature (T_J(MAX)), and package thermal resistance (θ_JA). The typical θ_JA rating given is worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
OPERATING RATINGS ⁽¹⁾
Input Supply Voltage, V_IN
Output Voltage, V_OUT
Enable Input Voltage, V_EN
Output Current (DC)
Junction Temperature ⁽²⁾
2.25V to 5.5V
V_ADJ to 5V
0.0V to 5.5V
1 mA to 3A
−40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) Device operation must be evaluated, and derated as needed, based on ambient temperature (T_A), power dissipation (P_D), maximum
allowable operating junction temperature (T_J(MAX)), and package thermal resistance (θ_JA). The typical θ_JA rating given is worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
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