DS90UB933-Q1 Datasheet, PDF (3/7 Pages) Texas Instruments – FPD-Link III Serializer

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5 Device and Documentation Support
DS90UB933-Q1
SNLS546 – AUGUST 2016
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
• Understanding the I2C Bus (SLVA704)
• I2C Bus Pullup Resistor Calculation (SLVA689
•
• Soldering Specifications Application Report, SNOA549
• IC Package Thermal Metrics Application Report, SPRA953
• AN-1187 Leadless Leadframe Package (LLP) Application Report, SNOA401
• LVDS Owner's Manual, SNLA187
5.2 Trademarks
All trademarks are the property of their respective owners.
5.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: DS90UB933-Q1
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