DRV8870_16 Datasheet, PDF (3/25 Pages) Texas Instruments – Brushed DC Motor Driver

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5 Pin Configuration and Functions
GND 1
IN2 2
IN1 3
VREF ⁴
DDA Package
8-Pin HSOP
Top View
Thermal
Pad
DRV8870
SLVSCY8A – AUGUST 2015 – REVISED JANUARY 2016
8 OUT2
7 ISEN
6 OUT1
5 VM
PIN
NAME
NO.
GND
1
IN1
3
IN2
2
ISEN
7
OUT1
6
OUT2
8
PAD
—
VM
5
VREF
4
TYPE
PWR
I
PWR
O
—
PWR
I
Pin Functions
DESCRIPTION
Logic ground
Connect to board ground
Logic inputs
Controls the H-bridge output. Has internal pulldowns. (See Table 1.)
If using current regulation, connect ISEN to a resistor (low-value,
High-current ground path high-power-rating) to ground. If not using current regulation, connect
ISEN directly to ground.
H-bridge output
Connect directly to the motor or other inductive load.
Thermal pad
6.5-V to 45-V power
supply
Analog input
Connect to board ground. For good thermal dissipation, use large
ground planes on multiple layers, and multiple nearby vias
connecting those planes.
Connect a 0.1-µF bypass capacitor to ground, as well as sufficient
bulk capacitance, rated for the VM voltage.
Apply a voltage between 0.3 to 5 V. For information on current
regulation, see the Current Regulation section.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
MIN
MAX
UNIT
Power supply voltage (VM)
–0.3
50
V
Power supply voltage ramp rate (VM)
0
2
V/µs
Logic input voltage (IN1, IN2)
–0.3
7
V
Reference input pin voltage (VREF)
–0.3
6
V
Continuous phase node pin voltage (OUT1, OUT2)
Current sense input pin voltage (ISEN) ⁽²⁾
–0.7
VM + 0.7
V
–0.5
1
V
Operating junction temperature, T_J
Storage temperature, T_stg
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transients of ±1 V for less than 25 ns are acceptable
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